QUICKTURNCIRCUITS SPECIALIZED MANUFACTURING CAPABILITIES

• FR-4:

  • Multi-functional epoxy system

  • Used as our standard multilayer material

• FR-4/170Tg

  • Multi-functional Epoxy Laminate and Prepreg

  • Tg of 170 C (DSC)

  • FR-406 can be used in applications where a higher temperature material is needed

  • Produces high yields using standard FR-4 processing

• FR-4/180Tg

  • High-performance FR-4 epoxy laminate and prepreg

  • Tg of 180 C (DSC)

  • Llow dielectric constant is an ideal for faster signal speed and improved signal integrity

  • Material is recommneded when layer counts begin to exceed 8 layers

  • Higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs

• JP-Copper clad plated materials

• JP-Aluminum clad plated materials

• Rigid, Rigid-Flex and Flex

• Roger, Arlon, Polyimide pcb’s

• Laser microvias

  • Both blind and buried vias

  • Controlled depth drilling capabilities

• High-density interconnect (HDI)

  • Extremely fine line circuitry

  • Ultra-fine pitch surface mount

• RF/microwave applications

  • Utilizing high performance materials from Rogers, Taconic and Arlon

• Variety of surface finishes:

  • Including:

  • OSP (ENTEK PLUS)

  • HASL

  • Electroless Nickel/Immersion Gold

  • Electroless Nickel/Electroless Gold

• High aspect ratio plating up to 15:1

• Laser skiving cover sheet for flex circuit applications.

• Layer count lamination available up to 16 layers with controlled impedance.

For pricing and other questions call us today.