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We use only high quality materials to provide you with the best products. To learn more about our specialized manufacturing capabilities, review the list below.


  • FR-4:

    • Multi-functional epoxy system

    • Used as our standard multilayer material

  • FR-4/170Tg

    • Multi-functional Epoxy Laminate and Prepreg

    • Tg of 170 C (DSC)

    • FR-406 can be used in applications where a higher temperature material is needed

    • Produces high yields using standard FR-4 processing

  • FR-4/180Tg

    • High-performance FR-4 epoxy laminate and prepreg

    • Tg of 180 C (DSC)

    • Llow dielectric constant is an ideal for faster signal speed and improved signal integrity

    • Material is recommneded when layer counts begin to exceed 8 layers

    • Higher thermal properties minimize Z-axis expansion and the potential for barrel cracking and pad lifting in complex designs

  • JP-Copper clad plated materials

  • JP-Aluminum clad plated materials

  • Rigid, Rigid-Flex and Flex

  • Roger, Arlon, Polyimide pcb’s

  • Laser microvias

    • Both blind and buried vias

    • Controlled depth drilling capabilities

  • High-density interconnect (HDI)

    • Extremely fine line circuitry

    • Ultra-fine pitch surface mount

  • RF/microwave applications

    • Utilizing high performance materials from Rogers, Taconic and Arlon

  • Variety of surface finishes:

    • Including:


    • HASL

    • Electroless Nickel/Immersion Gold

    • Electroless Nickel/Electroless Gold

  • High aspect ratio plating up to 15:1

  • Laser skiving cover sheet for flex circuit applications.

  • Layer count lamination available up to 16 layers with controlled impedance.

For pricing and other questions call us today.

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